new type of electroplating power supply equipment-high-frequency switching power supply. It combines the advantages of the waveform smoothness of silicon rectifiers and the convenience of voltage regulation of silicon-controlled rectifiers. It has the highest current efficiency (up to 90% or more) and the smallest volume. It is a promising rectifier. The manufacturing technology has solved the power problem, and the high-power switching power supply from thousands of amps to tens of thousands of amps has entered the practical stage of production.
It directly rectifies and filters the AC power grid through the EMI anti-electromagnetic interference line filter, converts the DC voltage into a high-frequency square wave of tens or hundreds of kHz through the converter, isolates and reduces the voltage through the high-frequency transformer, and then through the high Frequency filtering output DC voltage. After sampling, comparing, amplifying and controlling, driving circuit, the duty ratio of the power tube in the converter is controlled to obtain a stable output voltage (or output current).
The adjustment tube of the high-frequency switching rectifier works in the switching state, the power loss is small, the efficiency can reach 75% to 90%, the volume is small, the weight is light, and the accuracy and ripple coefficient are better than the silicon rectifier, which can be in the full output range. Achieve the precision required by production. It has self-protection ability and can start and stop arbitrarily under load. It can be easily connected with a computer, which brings great convenience to automated production and is widely used in the PCB plating industry.
Features
Using timing control function, the setting is simple and convenient, and the working time of positive and negative current polarity can be arbitrarily set according to the plating process requirements.
It has three working states of automatic cycle commutation, positive and negative, and reverse, and can automatically change the polarity of the output current.
The superiority of periodic commutation pulse plating
1 Reverse pulse current improves the thickness distribution of the coating, the thickness of the coating is uniform, and the leveling is good.
2 The anode dissolution of the reverse pulse makes the concentration of metal ions on the cathode surface rise quickly, which is conducive to the use of a high pulse current density in the subsequent cathode cycle, and the high pulse current density makes the formation speed of the crystal nucleus faster than the growth rate of the crystal, so The coating is dense and bright, with low porosity.
3. The reverse pulse anode stripping greatly reduces the adhesion of organic impurities (including brightener) in the coating, so the coating has high purity and strong resistance to discoloration, which is particularly prominent in silver cyanide plating.
4. The reverse pulse current oxidizes the hydrogen contained in the coating, which can eliminate hydrogen embrittlement (such as the reverse pulse can remove the co-deposited hydrogen during the electrodeposition of palladium) or reduce the internal stress.
5. The periodic reverse pulse current keeps the surface of the plated part in an active state all the time, so that a plating layer with good bonding force can be obtained.
6. Reverse pulse is helpful to reduce the actual thickness of the diffusion layer and improve the cathode current efficiency. Therefore, proper pulse parameters will further accelerate the deposition rate of the coating.
7 In the plating system that does not allow or a small amount of additives, double pulse plating can obtain a fine, smooth, and smooth coating.
As a result, the coating’s performance indicators such as temperature resistance, wear resistance, welding, toughness, corrosion resistance, conductivity, resistance to discoloration, and smoothness have increased exponentially, and it can greatly save rare and precious metals (about 20%-50%) and save additives (such as Bright silver cyanide plating is about 50%-80%)