45V 2000A 90KW Air Cooling IGBT Type Rectifier for Electroplating

Product Description:

Specifications:

Input parameters: Three phase AC415V±10%, 50HZ

Output parameters: DC 0~45V 0~2000A

Output mode: Common DC output

Cooling method: Air cooling

Power supply type: IGBT-based High-frequency Power Supply

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Specification
Faucet Type	Bathroom Sink Faucets,
Installation Type	Centerset,
Installation Holes	One Hole,
Number of Handles	Single Handle,
Finish	Ti-PVD,
Style	Country,
Flow Rate	1.5 GPM (5.7 L/min) max,
Valve Type	Ceramic Valve,
Cold and Hot Switch	Yes,
Dimensions
Overall Height	240 mm ( 9.5 " ),
Spout Height	155 mm ( 6.1 " ),
Spout Length	160 mm ( 6.3 " ),
Faucet center	Single Hole,
Material
Faucet Body Material	Brass,
Faucet Spout Material	Brass,
Faucet Handle Material	Brass,
Accessories Information
Valve included	Yes,
Drain included	No,
Weights
Net Weight (kg)	0.99,
Shipping Weight (kg)	1.17,

feature

Input Parameters

AC Input 480v±10% 3 Phase
Output Parameters

DC 0~50V 0~5000A continuously adjustable
Output Power

250KW
Cooling Method

forced air cooling / water cooling
PLC Analog

0-10V/ 4-20mA/ 0-5V
Interface

RS485/ RS232
Control Mode

remote control design
Screen Display

digital display
Multiple Protections

lack phase over-heating over-voltage over-current short circuit
Control Way

PLC/ Microcontroller

Model & Data

Model number	Output ripple	Current display precision	Volt display precision	CC/CV Precision	Ramp-up and ramp-down	Over-shoot
GKD45-2000CVC	VPP≤0.5%	≤10mA	≤10mV	≤10mA/10mV	0~99S	No

Product Applications

Application Industry: PCB Naked layer copper plating

In the PCB manufacturing process, electroless copper plating is an important step. It is widely used in the following two processes. One is plating onto bare laminate and the other is plating through hole, because under these two circumstances, electroplating cannot or can hardly be carried out. In the process of plating onto bare laminate, electroless copper plating plates a thin layer of copper on the bare substrate to make the substrate conductive for further electroplating. In the process of plating through hole, electroless copper plating is used to make the inner walls of the hole conductive to connect the printed circuits in different layers or the pins of the integrated chips.

The principle of electroless copper deposition is to use the chemical reaction between a reducing agent and a copper salt in a liquid solution so that the copper ion can be reduced to a copper atom. The reaction should be continuous so that sufficient copper can form a film and cover the substrate.

This series of rectifier is special designed for PCB Naked layer copper plating, adopt small size to optimized the installation space, the low and high current can be controlled by automated switching, the air cooling used independent enclosed air duct, synchronous rectification and energy saving, these features ensure high precision, stable performance and reliability.